(1)等离子清洗-Plasma Cleaning (2)物理气相沉积-PVD(Physical Vapor Deposition)
(3)等离子体增强化学的气相沉积-PECVD ( Plasma Enhanced Chemical Vapor Deposition )
(4)高密度等离子体化学气相淀积-HDPCVD(High Density Plasma CVD) (5)反应离子刻蚀-Etching(ICP-RIE)
APG射频电源
AM自动匹配器